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Haverhill, MA – USI, a leader in high performance coating application equipment, announced today that its proprietary spray coating systems reduce the overall cost in package-level Electromagnetic Interference (EMI) shielding processes compared to sputtering-based coating equipment. USI’s PRISM systems employ a nozzle-less ultrasonic spray technology that reliably achieves a thin, uniform coating in high-volume production environments such as mobile device manufacturing and others. USI’s capability enables the latest generation of silver EMI coating materials to be applied at the component level in a cost effective process.

Today’s silver EMI coatings are capable of achieving EMI shield effectiveness equivalent to sputtering when applied in ultra-thin layers in the 1 to 10 micrometer range. When applied uniformly at the required minimum thickness, these latest generation silver materials deliver high performance at a much lower process cost.

“For companies, such as device manufacturers, EMI shielding is moving from the board level to the package level,” said Larry Sirois, Senior Sales Engineer at USI. “For smart devices and other applications, silver coatings applied by PRISM systems can provide the same EMI shield effectiveness at a lower cost than sputtering. The PRISM system applies exactly enough coating to attain the required shield effectiveness, with minimal waste. This new level of efficiency in the EMI process drives a lower overall process cost.”

According to Sirois, factors contributing to the PRISM system’s superiority in silver EMI shield coating applications include the ability to work with the new higher solids material formulations, software control of all key process parameters, and the efficiency of USI’s nozzle-less ultrasonic spray technology.

Electromagnetic Interference (EMI) is a process by which disruptive electromagnetic energy is transmitted from one electronic device to another via radiated or conducted paths, or both. In electronic components, devices and systems, EMI can adversely affect performance of today’s faster, smaller, electronic device that contains digital circuits. EMI shielding helps designers obtain the highest possible operating and processing speeds from the smallest possible physical package without performance-degrading interference.