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USI’s nozzle-less ultra-Thin Coating Application Technology (tCAT) is proven effective in applying a variety of coatings used in semiconductor packaging applications. Nozzle-less ultra-Thin Coating Application Technology (tCAT) has proven effective at applying a thin, uniform film of coating to substrates that are not suited for spin coating techniques, such as odd-shaped wafers, glass panels, MEMS devices and semiconductor packages, typical coatings include:
- Photo-imageable solder masks
- Silver coatings for EMI shielding applications
- SOL-GEL solutions
- Plasma Dicing
- Other proprietary coatings
Coating thicknesses of down to sub-micron level are easily achieved with superior uniformity and very high levels of transfer efficiency.
USI manufactures a full complement of high-performance spray coating equipment; the Prism BT Benchtop is designed for lab scale and R&D coating requirements, the Prism 500 coating system is a small footprint, stand-alone tool suitable for low to mid volume manufacturing requirements and the Prism 800 is engineered as a large format, high volume production machine.