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Polyimide Coating

Polyimides are high performance insulating materials used in may applications including the fabrication of multi-layer high-density interconnects for advanced packaging.  In the case of wafer-level and panel-level packaging a photoimageable polyimide is used to provide the passivation layer that enables connections between layers.  The polyimide must be applied in a uniform layer to ensure that the inter-layer connections can be properly formed.

 In the following example, the USI Prism 800 system was used to produce 7.5 micron diameter vias in a 10 micron thick layer of polyimide using a 300 mm diameter silicon wafer as the test substrate.  

Polyimide Thickness Uniformity

The polyimide layer thickness was measured across the surface of a 300 mm diameter wafer.

Polyimide Uniformity Data

A statistical analysis of the polyimide film thickness data is presented above.

7.5 Micron Diameter Via

7.5 micron vias are produced in a ployimide layer applied with USI’s nozzle-less ultrasonic spray technology. 

The same results have also been achieved on panel size substrates up to 650 mm x 650 mm.  Please contact us directly to receive a detailed technical presentation and paper on this promising new process.

Contact us to discuss your coating requirements.

USI Download Center

To download technical articles and product brochures, please click the following link:
USI Technical Library

Want to Learn More about Polyimide Coating?

Contact USI for more information on this important new process.