USI's nozzle-less ultrasonic coating technology is proven effective in applying a thin, uniform coating of photoresist, polyimides and nano-suspensions and solutions where a typical spin coating method is ineffective, such as applications featuring non-circular substrates or substrates requiring uniform coverage on 3-D surface features or the sidewalls of trenches.

Applications include semiconductor wafers, MEMS, glass plates, and other flat substrates.

Contact us to discuss your particular application requirements.