There are many scenarios where "non standard" semiconductor wafers and other flat substrates require the thin, uniform application of photoresist. Such cases include wafers with surface structures, features, or trenches, and wafers or substrates with non-circular shapes. The traditional spin coating method has proven ineffective in applying a thin, uniform coating in these cases and it tends to waste a significant amount of coating.

Other semiconductor applications include the deposition of polyimides, conductive inks and paints containnig silver and copper particles, and liquids containing carbon nanotubes and nanoparticles.

Whatever the requirement, USI's patented, nozzle-less ultrasonic spray technology can provide the precision and reliability necessary.

Visit our product pages to learn more about our Prism 300/400 coating system or feel free to contact us for additional information.