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Semiconductor Applications

USI’s nozzle-less ultra-Thin Coating Application Technology (tCAT) is proven effective in applying a variety of coatings used in semiconductor packaging applications. Nozzle-less ultra-Thin Coating Application Technology (tCAT) has proven effective at applying a thin, uniform film of coating to substrates that are not suited for spin coating techniques, such as odd-shaped wafers, glass panels, MEMS devices and semiconductor packages, typical coatings include:

  • Photoresists
  • Polyimides
  • Photo-imagable solder masks
  • Silver coatings for EMI shielding applications
  • SOL-GEL soluitions
  • Other proprieatary coatings

Coating thicknesses of down to sub-micron level are easily achieved with superior uniformity and very high levels of transfer efficiency.

USI manufactures a full complement of high-performance spray coating equipment; the Prism BT Benchtop is designed for lab scale and R&D coating requirements, the Prism 500 coating system is a small footprint, stand-alone tool suitable for low to mid volume manufacturing requirements and the Prism 800 is engineered as a large format, high volume production machine.

Please visit our PRISM 400 BT (Benchtop), PRISM 500, and PRISM 800 product pages or contact us directly for more information.

USI Download Center

To download technical articles and product brochures, please click the following link:
USI Technical Library